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Ann Desrochers |
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BILLERICA, Massachusetts, June 14, 2005 - CSP Inc. (NASDAQ: CSPI) MultiComputer Division, a leading supplier of embedded high-performance cluster computing systems, today announced that it is expanding its FastCluster 2000 SERIES product line with the introduction of its new Conduction Cooled blades. Designed with the mature Myrinet clustering technology and the latest 7447 PowerPC AltiVec processor from Freescale, these conduction cooled blades address the requirements of the most demanding DOD programs, combining high performance I/O streaming features and scalable HPC clustering capabilities. "With this new Conduction Cooled offering, CSPI delivers on its commitment to bring the advantages of the FastCluster open platform to extreme environmental conditions. Rugged COTS applications benefit from the FastCluster architecture when power consumption, space and weight are at a premium and scalability is required," said Alexander R. Lupinetti, President, and CEO of CSP Inc. Conduction-cooled FastCluster blades are designed to the IEEE 1101.2 standard and CSPI's Level III environmental specification to insure reliable system operation when subjected to wide temperature ranges, moisture, vibration or extreme shock, or dirty or corrosive atmospheres and environments with little or no airflow. The new FastCluster conduction cooled blades will be available in dual and quad processor versions on a single 6U blade. The dual processor version is an ideal choice to address high performance I/O streaming requirements offering two independent Myrinet PowerPC 7447 compute nodes and two independent PMC slots. Each streaming node is directly interfaced to the backplane Myrinet switch fabric. The quad processor version targets high compute density requirements with four independent PowerPC 7447 compute nodes interconnected with a 16 port Myrinet switch (full duplex). The FastCluster 2000 SERIES architecture supports 1 GB/s of interconnect to the backplane Myrinet clustering fabric via the VME PO connector (VITA 26 Myrinet ANSI Standard). "Today we are expanding our COTS offering by introducing the first Scalable, Open, Conduction Cooled Embedded Cluster" said Bernard Pelon, Director of Product Research. The new dual and quad conduction cooled blades leverage the established open software environment currently available for the FastCluster convection cooled platform. The FastCluster standard development platform includes: the VSIPL and ISSPL Optimized Signal Processing Libraries for PowerPC AltiVec, the optimized MPI Message Passing Interface over Myrinet, the VxWorks Real Time Kernel and Tornado Development Environment and the Linux OS and Open Source Development Package. The dual and quad processor versions of the conduction cooled blades are scheduled for release in Q4 2005. About
CSP Inc. Based in Billerica, Massachusetts, CSP Inc. (NASDAQ: CSPI) and its subsidiaries develop and market IT integration solutions for complex IT environments as well messaging and image processing software and high-performance cluster computer systems for commercial, scientific, and defense customers worldwide. The MultiComputer Division helps its customers solve high-performance computing problems in the defense market by supplying very dense cluster computer systems with powerful real-time I/O capabilities that require minimal physical space or power. These systems are used in a broad array of applications, including software defined radio, radar, sonar and surveillance signal processing. For more information about CSP Inc., visit http://www.cspi.com or call us at 1 (800) 325-3110.
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